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Fabrication Schedule

To apply for Peer-Reviewed Subsidized Pricing, please click a date in the calendar to access an application.
 For Canadian Academic Pricing, not subject to Peer Review, please contact 
fab@cmc.ca.

Notes:
Cancelled runs are listed in red
Other technologies are available subject to demand.  Please see table at bottom of Fab Schedule for these technologies.
 
Please contact fab@cmc.ca for more information.
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TechnologyDescription
FlowJEMQuick turnaround, cost effective rigid polymer fabrication technology
for microfluidic devices
UW-MEMS/ (CIRFE)Two gold layers surface micromaching process on alumina substrate
Turnaround time: TBA
Sensonit/ (Micronit)Sensonit: customized depth microchannels and integrated electrodes on glass substrates
with optional ITO in-channel electrode or back side metal electrode
Average Cycle Time:  12 Weeks
CMOSP8G/HighVoltage (TeledyneDALSA)0.8-micron 5V mixed-signal; CMOS 40-300V DMOS and PMOS transistors; 5V CMOS isolated from
40-300V CMOS; PNP bipolar and isolated NPN bipolar; Dual gate oxide technology; Hi-res poly option
[5kOhms/sq]; double poly capacitors; triple metal with TiN barrier; P-type epitaxy over p+ substrate
Average Cycle Time:  27 Weeks
CMOSP8C/Standard (TeledyneDALSA)0.8-micron 2.7V-5.5V mixed-signal CMOS;
Double poly; Triple metal; Hi-res poly option [10kOhms/sq];
Twin-tub process on N-type or P-type wafers
Average Cycle Time:  27 Weeks
LTCC Custom configurations and stack up are available on demand. Please contact CMC for details
NanoSOINanopatterning of metal and silicon using e-beam litho. Process conducted on SOI with optional oxide etch.
Average turnaround time is 9 weeks.
IMEC SOIIMEC Standard SiPhotonics

 
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