Access products and services for your microsystems R&D
Fabrication Schedule

To apply for Peer-Reviewed Subsidized Pricing, please click a date in the calendar to access an application.
 For Canadian Academic Pricing, not subject to Peer Review, please contact 
fab@cmc.ca.

NSERC funding for CMC Microsystems ends March 2019. No source of government funding has been identified to continue fabrication runs beyond that date.  Check the schedule below to identify your last chance to access the technology of your choice.
This will impact your research.  To have your voice heard through letters of support to the federal government, please follow these 
instructions.  Thank you!
 
Notes:
Cancelled runs are listed in red
Other technologies are available subject to demand.  Please see table at bottom of Fab Schedule for these technologies.
 
Please contact fab@cmc.ca for more information.
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TechnologyDescription
FlowJEMQuick turnaround, cost effective rigid polymer fabrication technology
for microfluidic devices
UW-MEMS/ (CIRFE)Two gold layers surface micromaching process on alumina substrate
Turnaround time: TBA
Sensonit/ (Micronit)Sensonit: customized depth microchannels and integrated electrodes on glass substrates
with optional ITO in-channel electrode or back side metal electrode
Average Cycle Time:  12 Weeks
CMOSP8G/HighVoltage (TeledyneDALSA)0.8-micron 5V mixed-signal; CMOS 40-300V DMOS and PMOS transistors; 5V CMOS isolated from
40-300V CMOS; PNP bipolar and isolated NPN bipolar; Dual gate oxide technology; Hi-res poly option
[5kOhms/sq]; double poly capacitors; triple metal with TiN barrier; P-type epitaxy over p+ substrate
Average Cycle Time:  27 Weeks
CMOSP8C/Standard (TeledyneDALSA)0.8-micron 2.7V-5.5V mixed-signal CMOS;
Double poly; Triple metal; Hi-res poly option [10kOhms/sq];
Twin-tub process on N-type or P-type wafers
Average Cycle Time:  27 Weeks
LTCC Custom configurations and stack up are available on demand. Please contact CMC for details
NanoSOINanopatterning of metal and silicon using e-beam litho. Process conducted on SOI with optional oxide etch.
Average turnaround time is 9 weeks.
IMEC SOIIMEC Standard SiPhotonics

 
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