0.13 µm CMOS (TSMC)
  
Taiwan Semiconductor Manufacturing Company, Limited
0.13-micron CMOS mixed-mode/RF process; 1.2V core and 3.3V capable I/O’s; 1 poly, 8 metal layers; with ultra-thick topmetal (UTM8) and SRAM support options.
Nominal Expected Cycle Time: 13 Weeks  
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