CMOSP13/ (TSMC)
  
“0.13-micron CMOS mixed-mode/RF process; 1.2V core and 3.3V capable I/O’s; 1 poly, 8 metal layers; with ultra-thick topmetal (UTM8) and SRAM support options.”
Nominal Expected Cycle Time: 13 Weeks 
 
Click here to see your activities